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INTEGRATED CIRCUITS
DATA SHEET
74AHC257; 74AHCT257 Quad 2-input multiplexer; 3-state
Product specification File under Integrated Circuits, IC06 2000 Apr 03
Philips Semiconductors
Product specification
Quad 2-input multiplexer; 3-state
FEATURES * ESD protection: HBM EIA/JESD22-A114-A exceeds 2000 V MM EIA/JESD22-A115-A exceeds 200 V CDM EIA/JESD22-C101 exceeds 1000 V * Balanced propagation delays * All inputs have Schmitt-trigger actions * Non-inverting data path * Inputs accept voltages higher than VCC * For AHC only: operates with CMOS input levels * For AHCT only: operates with TTL input levels * Specified from -40 to +85 C and -40 to +125 C. DESCRIPTION The 74AHC/AHCT257 are high-speed Si-gate CMOS devices and are pin compatible with Low power Schottky TTL (LSTTL). They are specified in compliance with JEDEC standard No. 7A. The 74AHC/AHCT257 has four identical 2-input multiplexers with 3-state outputs, which select 4 bits of QUICK REFERENCE DATA GND = 0 V; Tamb = 25 C; tr = tf 3.0 ns.
74AHC257; 74AHCT257
data from two sources and are controlled by a common data select input (S). The data inputs from source 0 (1I0 to 4I0) are selected when input S is LOW and the data inputs from source 1 (1I1 to 4I1) are selected when S is HIGH. Data appears at the outputs (1Y to 4Y) in true (non-inverting) form from the selected inputs. The 74AHC/AHCT257 is the logic implementation of a 4-pole 2-position switch, where the position of the switch is determined by the logic levels applied to S. The outputs are forced to a high impedance OFF-state when OE is HIGH. If OE is LOW then the logic equations for the outputs are: 1Y = 1I1 x S + 1I0 x S; 2Y = 2I1 x S + 2I0 x S; 3Y = 3I1 x S + 3I0 x S; 4Y = 4I1 x S + 4I0 x S. The `257' is identical to the `258' but has non-inverting (true) outputs.
TYPICAL SYMBOL tPHL/tPLH PARAMETER propagation delay nl0, nI1 to nY S to nY CI CO CPD input capacitance output capacitance power dissipation capacitance CL = 50 pF; fi = 1 MHz; notes 1 and 2 4 outputs switching via input S 1 output switching via input I Notes 1. CPD is used to determine the dynamic power dissipation (PD in W). PD = CPD x VCC2 x fi + (CL x VCC2 x fo) where: fi = input frequency in MHz; fo = output frequency in MHz; (CL x VCC2 x fo) = sum of outputs; CL = output load capacitance in pF; VCC = supply voltage in Volts. 2. The condition is VI = GND to VCC. 2000 Apr 03 2 45 15 51 15 pF pF CL = 15 pF; VCC = 5 V CL = 15 pF; VCC = 5 V VI = VCC or GND 2.9 3.5 3.0 4.0 3.7 5.1 3.0 4.0 ns ns pF pF CONDITIONS AHC AHCT UNIT
Philips Semiconductors
Product specification
Quad 2-input multiplexer; 3-state
FUNCTION TABLE See note 1. INPUT OE H L L L L Note 1. H = HIGH voltage level; L = LOW voltage level; X = don't care; Z = high impedance OFF-state. ORDERING INFORMATION PACKAGES TYPE NUMBER 74AHC257D 74AHC257PW 74AHCT257D 74AHCT257PW PINNING PIN 1 2, 5, 11 and 14 3, 6, 10 and 13 4, 7, 9 and 12 8 15 16 S 1I0 to 4I0 1I1 to 4I1 1Y to 4Y GND OE VCC SYMBOL common data select input data inputs from source 0 data inputs from source 1 multiplexer outputs ground (0 V) output enable input (active LOW) DC supply voltage DESCRIPTION TEMPERATURE RANGE -40 to +125 C PINS 16 16 16 16 PACKAGE SO TSSOP SO TSSOP S X H H L L nI0 X X X L H nI1 X L H X X
74AHC257; 74AHCT257
OUTPUT nY Z L H L H
MATERIAL plastic plastic plastic plastic
CODE SOT109-1 SOT403-1 SOT109-1 SOT403-1
2000 Apr 03
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Philips Semiconductors
Product specification
Quad 2-input multiplexer; 3-state
74AHC257; 74AHCT257
handbook, halfpage
S1 1I0 2 1I1 3 1Y 4
16 VCC 15 OE 14 4I0
handbook, halfpage
2
3
5
6
11
10
14
13
1I0 1I1 2I0 2I1 3I0 3I1 4I0 4I1 1 15 S OE 1Y 4 2Y 7 3Y 9 4Y 12
MNA537
257
2I0 5 2I1 6 2Y 7 GND 8
MNA536
13 4I1 12 4Y 11 3I0 10 3I1 9 3Y
Fig.1 Pin configuration.
Fig.2 Logic symbol.
handbook, halfpage handbook, halfpage
1 15
G1 EN MUX
2 3 5
1I0 1I1 2I0 2I1 3I0 3I1 4I0 4I1 SELECTOR 3-STATE MULTIPLEXER OUTPUTS
1Y
4
2 3 5 6 11 10 14 13
1 1
4
2Y
6 11 10
7
7 9
3Y
9
14 13
4Y 12
12 S
MNA538
OE 15
MNA540
1
Fig.3 IEC logic symbol.
Fig.4 Functional diagram.
2000 Apr 03
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Philips Semiconductors
Product specification
Quad 2-input multiplexer; 3-state
74AHC257; 74AHCT257
handbook, full pagewidth
1I0 1I1
1Y
2I0 2I1
2Y
3I0 3I1
3Y
4I0 4I1
4Y
OE
MNA539
S
Fig.5 Logic diagram.
2000 Apr 03
5
Philips Semiconductors
Product specification
Quad 2-input multiplexer; 3-state
RECOMMENDED OPERATING CONDITIONS 74AHC SYMBOL VCC VI VO Tamb PARAMETER DC supply voltage input voltage output voltage operating ambient temperature see DC and AC characteristics per device VCC = 3.3 0.3 V VCC = 5 0.5 V CONDITIONS MIN. 2.0 0 0 -40 -40 - - TYP. MAX. MIN. 5.0 - - +25 +25 - - 5.5 5.5 VCC +85 4.5 0 0 -40
74AHC257; 74AHCT257
74AHCT UNIT TYP. MAX. 5.0 - - +25 +25 - - 5.5 5.5 VCC +85 V V V C
+125 -40 100 20 - -
+125 C - 20 ns/V ns/V
tr, tf (t/V)
input rise and fall time ratios
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134); voltages are referenced to GND (ground = 0 V). SYMBOL VCC VI IIK IOK IO ICC; IGND Tstg PD Notes 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. For SO packages: above 70 C the value of PD derates linearly with 8 mW/K. For TSSOP packages: above 60 C the value of PD derates linearly with 5.5 mW/K. PARAMETER DC supply voltage input voltage DC input diode current DC output clamping diode current DC output sink current DC VCC or GND current storage temperature power dissipation per package for temperature range: -40 to +125 C; note 2 VI < -0.5 V; note 1 VO < -0.5 V or VO > VCC + 0.5 V; note 1 -0.5 V < VO < VCC + 0.5 V CONDITIONS MIN. MAX. UNIT -0.5 -0.5 - - - - -65 - +7.0 +7.0 -20 20 25 75 500 V V mA mA mA mA mW
+150 C
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Philips Semiconductors
Product specification
Quad 2-input multiplexer; 3-state
DC CHARACTERISTICS 74AHC family Over recommended operating conditions; voltages are referenced to GND (ground = 0 V). TEST CONDITIONS SYMBOL PARAMETER OTHER VIH HIGH-level input voltage VCC (V) 2.0 3.0 5.5 VIL LOW-level input voltage 2.0 3.0 5.5 VOH HIGH-level output voltage VI = VIH or VIL; IO = -50 A VI = VIH or VIL; IO = -4.0 mA VI = VIH or VIL; IO = -8.0 mA VOL LOW-level output voltage VI = VIH or VIL; IO = 50 A VI = VIH or VIL; IO = 4.0 mA VI = VIH or VIL; IO = 8.0 mA II IOZ ICC CI input leakage current 3-state output OFF current quiescent supply current input capacitance VI = VCC or GND 2.0 3.0 4.5 3.0 4.5 2.0 3.0 4.5 3.0 4.5 5.5 MIN. 1.5 2.1 - - - 1.9 2.9 4.4 - - - - - 2.0 3.0 4.5 25 TYP. - - - 0.5 0.9 1.65 - - - - - 0.1 0.1 0.1 0.36 0.36 0.1 Tamb (C) -40 to +85 - - 0.5 0.9 1.65 - - -
74AHC257; 74AHCT257
-40 to +125 UNIT - - 0.5 0.9 1.65 - - -
MAX. MIN. MAX. MIN. MAX. 1.5 2.1 - - - 1.9 2.9 4.4 1.5 2.1 - - - 1.9 2.9 4.4 V V V V V V V V V V V V V V V V A
3.85 -
3.85 -
3.85 -
2.58 - 3.94 - - - - - - - - - - 0 0 0 - - - - - 3
2.48 - 3.8 - - - - - - - 0.1 0.1 0.1 0.44 0.44 1.0 2.5 40 10
2.40 - 3.70 - - - - - - - - - - 0.1 0.1 0.1 0.55 0.55 2.0
VI = VIH or VIL; 5.5 VO = VCC or GND VI = VCC or GND; IO = 0 5.5 -
0.25 - 4.0 10 - -
10.0 A 80 10 A pF
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Philips Semiconductors
Product specification
Quad 2-input multiplexer; 3-state
74AHCT family Over recommended operating conditions; voltages are referenced to GND (ground = 0 V). TEST CONDITIONS SYMBOL PARAMETER OTHER VIH VIL VOH HIGH-level input voltage LOW-level input voltage HIGH-level output voltage VI = VIH or VIL; IO = -50 A VI = VIH or VIL; IO = -8.0 mA VOL LOW-level output voltage VI = VIH or VIL; IO = 50 A VI = VIH or VIL; IO = 8.0 mA II IOZ input leakage current 3-state output OFF current VI = VIH or VIL VCC (V) - - 4.5 25 - 0.8 - - 0.1 0.36 0.1 Tamb (C) -40 to +85 - 0.8 - - 0.1 0.44 1.0 2.5
74AHC257; 74AHCT257
-40 to +125 UNIT - 0.8 -
MIN. TYP. MAX. MIN. MAX. MIN. MAX. 2.0 - 4.4 3.8 - - - 2.0 - 4.4 V V V V V V A
4.5 to 5.5 2.0 4.5 to 5.5 - 4.5 4.5 4.5 4.5 5.5 4.4
3.94 - - - - - 0 - - -
3.70 - - - - - 0.1 0.55 2.0
VI = VIH or VIL; 5.5 VO = VCC or GND per input pin; other inputs at VCC or GND; IO = 0 VI = VCC or GND; 5.5 IO = 0 VI = VCC - 2.1 V other inputs at VCC or GND; IO = 0
0.25 -
10.0 A
ICC ICC
quiescent supply current additional quiescent supply current per input pin input capacitance
-
- -
4.0 1.35
- -
40 1.5
- -
80 1.5
A mA
4.5 to 5.5 -
CI
-
-
3
10
-
10
-
10
pF
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Philips Semiconductors
Product specification
Quad 2-input multiplexer; 3-state
AC CHARACTERISTICS Type 74AHC257 GND = 0 V; tr = tf 3.0 ns. TEST CONDITIONS SYMBOL PARAMETER WAVEFORMS VCC = 3.0 to 3.6 V; note 1 tPHL/tPLH propagation delay nI0 to nY; nI1 to nY propagation delay S to nY tPZH/tPZL tPHZ/tPLZ tPHL/tPLH 3-state output enable time OE to nY 3-state output disable time OE to nY propagation delay nI0 to nY; nI1 to nY propagation delay S to nY tPZH/tPZL tPHZ/tPLZ 3-state output enable time OE to nY 3-state output disable time OE to nY see Figs 7 and 8 see Figs 6 and 8 see Figs 7 and 8 see Figs 6 and 8 15 pF - - - - 50 pF - - - - 4.2 5.2 4.5 5.1 6.0 7.4 6.4 7.2 9.3 11.0 10.5 9.5 12.8 14.5 14.0 12.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 11.0 13.0 12.5 11.0 14.5 16.5 16.0 13.5 CL MIN. 25 TYP. Tamb (C) -40 to +85 MAX. MIN. MAX.
74AHC257; 74AHCT257
-40 to +125 MIN. MAX.
UNIT
1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0
12.0 14.0 13.5 11.5 16.0 18.5 17.5 14.5
ns ns ns ns ns ns ns ns
VCC = 4.5 to 5.5 V; note 2 tPHL/tPLH propagation delay nI0 to nY; nI1 to nY propagation delay S to nY tPZH/tPZL tPHZ/tPLZ tPHL/tPLH 3-state output enable time OE to nY 3-state output disable time OE to nY propagation delay nI0 to nY; nI1 to nY propagation delay S to nY tPZH/tPZL tPHZ/tPLZ Notes 1. Typical values at VCC = 3.3 V. 2. Typical values at VCC = 5.0 V. 3-state output enable time OE to nY 3-state output disable time OE to nY see Figs 7 and 8 see Figs 6 and 8 see Figs 7 and 8 see Figs 6 and 8 15 pF - - - - 50 pF - - - - 2.9 3.5 3.2 3.4 4.2 5.0 4.5 4.9 5.9 6.8 6.8 6.5 7.9 8.8 8.8 7.9 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 7.0 8.0 8.0 7.0 9.0 10.0 10.0 9.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 7.5 8.5 8.5 8.5 11.5 12.5 12.5 9.5 ns ns ns ns ns ns ns ns
2000 Apr 03
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Philips Semiconductors
Product specification
Quad 2-input multiplexer; 3-state
Type 74AHCT257 GND = 0 V; tr = tf 3.0 ns. TEST CONDITIONS SYMBOL PARAMETER WAVEFORMS VCC = 4.5 to 5.5 V; note 1 tPHL/tPLH propagation delay nI0 to nY; nI1 to nY propagation delay S to nY tPZH/tPZL tPHZ/tPLZ tPHL/tPLH 3-state output enable time OE to nY 3-state output disable time OE to nY propagation delay nI0 to nY; nI1 to nY propagation delay S to nY tPZH/tPZL tPHZ/tPLZ Note 1. Typical values at VCC = 5.0 V. AC WAVEFORMS 3-state output enable time OE to nY 3-state output disable time OE to nY see Figs 7 and 8 see Figs 6 and 8 see Figs 7 and 8 see Figs 6 and 8 15 pF - - - - 50 pF - - - - 3.7 5.1 3.9 4.5 4.9 6.4 5.1 6.5 6.5 9.0 8.0 7.5 8.5 10.5 10.0 9.5 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 8.0 10.5 9.0 8.0 10.0 12.5 11.0 10.5 CL MIN. 25 TYP. Tamb (C) -40 to +85 MAX. MIN. MAX.
74AHC257; 74AHCT257
-40 to +125 MIN. MAX.
UNIT
1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0
9.0 11.5 10.0 8.5 11.0 13.5 12.0 11.5
ns ns ns ns ns ns ns ns
handbook, halfpage
VI VM(1)
nI0, nI1, S input GND
t PHL VOH nY output VOL VM(2)
t PLH
MNA486
FAMILY AHC AHCT
VI INPUT REQUIREMENTS GND to VCC GND to 3.0 V
VM(1) INPUT 1.5 V
VM(2) OUTPUT 50% VCC
50% VCC 50% VCC
Fig.6 The data inputs (1I0, 1I1) and common data select input (S) to output (nY) propagation delays.
2000 Apr 03
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Philips Semiconductors
Product specification
Quad 2-input multiplexer; 3-state
74AHC257; 74AHCT257
handbook, full pagewidth
VI OE input GND tPLZ output LOW-to-OFF OFF-to-LOW VCC VM(2) VOL tPHZ VOH output HIGH-to-OFF OFF-to-HIGH GND outputs enabled outputs disabled outputs enabled
MNA450
VM(1)
tPZL
VOL + 0.3 V tPZH VOH - 0.3 V VM(2)
FAMILY AHC AHCT
VI INPUT REQUIREMENTS GND to VCC GND to 3.0 V
VM(1) INPUT 1.5 V
VM(2) OUTPUT 50% VCC
50% VCC 50% VCC
Fig.7 3-state enable and disable times.
handbook, full pagewidth
S1 VCC PULSE GENERATOR VI D.U.T. RT CL
MNA219
VO
1000
VCC open GND
TEST tPLH/tPHL tPLZ/tPZL tPHZ/tPZH open VCC GND
S1
Definitions for test circuit. CL = load capacitance including jig and probe capacitance (See Chapter "AC characteristics"). RT = termination resistance should be equal to the output impedance Zo of the pulse generator.
Fig.8 Load circuitry for switching times.
2000 Apr 03
11
Philips Semiconductors
Product specification
Quad 2-input multiplexer; 3-state
PACKAGE OUTLINES SO16: plastic small outline package; 16 leads; body width 3.9 mm
74AHC257; 74AHCT257
SOT109-1
D
E
A X
c y HE vMA
Z 16 9
Q A2 A1 pin 1 index Lp 1 e bp 8 wM L detail X (A 3) A
0
2.5 scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 1.75 0.069 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 10.0 9.8 E (1) 4.0 3.8 0.16 0.15 e 1.27 0.050 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 0.039 0.016 Q 0.7 0.6 0.028 0.020 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z (1) 0.7 0.3 0.028 0.012
0.010 0.057 0.004 0.049
0.019 0.0100 0.39 0.014 0.0075 0.38
0.244 0.041 0.228
8 0o
o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT109-1 REFERENCES IEC 076E07 JEDEC MS-012 EIAJ EUROPEAN PROJECTION
ISSUE DATE 97-05-22 99-12-27
2000 Apr 03
12
Philips Semiconductors
Product specification
Quad 2-input multiplexer; 3-state
74AHC257; 74AHCT257
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm
SOT403-1
D
E
A
X
c y HE vMA
Z
16
9
Q A2 pin 1 index A1 Lp L (A 3) A
1
e bp
8
wM detail X
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.10 A1 0.15 0.05 A2 0.95 0.80 A3 0.25 bp 0.30 0.19 c 0.2 0.1 D (1) 5.1 4.9 E (2) 4.5 4.3 e 0.65 HE 6.6 6.2 L 1.0 Lp 0.75 0.50 Q 0.4 0.3 v 0.2 w 0.13 y 0.1 Z (1) 0.40 0.06 8 0o
o
Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT403-1 REFERENCES IEC JEDEC MO-153 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-04-04 99-12-27
2000 Apr 03
13
Philips Semiconductors
Product specification
Quad 2-input multiplexer; 3-state
SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 230 C. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. Manual soldering
74AHC257; 74AHCT257
If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
2000 Apr 03
14
Philips Semiconductors
Product specification
Quad 2-input multiplexer; 3-state
Suitability of surface mount IC packages for wave and reflow soldering methods
74AHC257; 74AHCT257
SOLDERING METHOD PACKAGE WAVE BGA, LFBGA, SQFP, TFBGA HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS PLCC(3), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. not suitable not not not suitable(2) recommended(3)(4) recommended(5) suitable REFLOW(1) suitable suitable suitable suitable suitable
2000 Apr 03
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Philips Semiconductors
Product specification
Quad 2-input multiplexer; 3-state
DATA SHEET STATUS DATA SHEET STATUS Objective specification PRODUCT STATUS Development DEFINITIONS (1)
74AHC257; 74AHCT257
This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice. This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product.
Preliminary specification
Qualification
Product specification
Production
Note 1. Please consult the most recently issued data sheet before initiating or completing a design. DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
2000 Apr 03
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Philips Semiconductors
Product specification
Quad 2-input multiplexer; 3-state
NOTES
74AHC257; 74AHCT257
2000 Apr 03
17
Philips Semiconductors
Product specification
Quad 2-input multiplexer; 3-state
NOTES
74AHC257; 74AHCT257
2000 Apr 03
18
Philips Semiconductors
Product specification
Quad 2-input multiplexer; 3-state
NOTES
74AHC257; 74AHCT257
2000 Apr 03
19
Philips Semiconductors - a worldwide company
Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 68 9211, Fax. +359 2 68 9102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381, Fax. +1 800 943 0087 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V, Tel. +45 33 29 3333, Fax. +45 33 29 3905 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615 800, Fax. +358 9 6158 0920 France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex, Tel. +33 1 4099 6161, Fax. +33 1 4099 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 2353 60, Fax. +49 40 2353 6300 Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor, 254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966 Indonesia: PT Philips Development Corporation, Semiconductors Division, Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510, Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080 Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI), Tel. +39 039 203 6838, Fax +39 039 203 6800 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Pakistan: see Singapore Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW, Tel. +48 22 5710 000, Fax. +48 22 5710 001 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 58088 Newville 2114, Tel. +27 11 471 5401, Fax. +27 11 471 5398 South America: Al. Vicente Pinzon, 173, 6th floor, 04547-130 SAO PAULO, SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 821 2382 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 93 301 6312, Fax. +34 93 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 5985 2000, Fax. +46 8 5985 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2741 Fax. +41 1 488 3263 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye, ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381, Fax. +1 800 943 0087 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 3341 299, Fax.+381 11 3342 553
For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 2000
Internet: http://www.semiconductors.philips.com
SCA 69
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
613507/01/pp20
Date of release: 2000
Apr 03
Document order number:
9397 750 06997

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